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0.3 mm pitch CSP in development!

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Tel: 1-508-236-1868

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burninsockets@sensata.com

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Site Updated September 19, 2017

* * * Sensata > Products > Burn-in Sockets > BGA >

Burn-in Test Socket: 1.00 mm Pitch BGA (Ball Grid Array)


Mechanical Characteristics
Contact system
Normally closed
Package insertion force
ZIF
Contact force
Typical: Approximately 12g/pin
Range: 10–15g/pin
Durability
Minimum: 10,000 cycles
Temperature range
-40°C to 150°C
Contact point
Side of solder ball
Maximum IC offset
During load: ±0.5 mm in X or Y axis
Actuation force
Typical: 3.0–5.0kg

Electrical Characteristics
Current rating
1 amp per pin
Insulation resistance
1000 mohms at 500V DC
Dielectric voltage
Withstands 700V AC for 1 minute
Contact resistance at 10mA
Initial: 50 mohm maximum
After 10K cycles: 1 ohm maximum
Inductance
6nH at 50 MHz, approximately

Product Availability
Maximum package sizes and socket dimensions

Package max: 27 x 27 mm
Outline max: 46 x 46 mm

Package max: 19 x 19 mm
Outline max: 31 x 31 mm

Package max: 22 x 14 mm
Outline max: 31 x 23 mm
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1.0mm BGA IC Test and Burn-In Sockets

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