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Site Updated February 16, 2018

* * * Sensata > Support > Burn-in Test Socket Engineering > Contact Technology >

BGA Buckling Beam Contact Style for Burn-in Test Sockets
0.5 mm BGA Compression Mount or Through–hole Burn-in Sockets

Accommodating package sizes from 15x15mm to 5x5mm, the TI Interconnection burn-in socket portfolio for 0.5 mm pitch BGA packages is available in both compression mount and through–hole.

Sensata Interconnection 0.5 mm pitch burn-in sockets employ a vertically actuated “compression” style contact that interfaces with individual solder balls. The contact-to-ball, interfaced at two locations per ball, gives minimum spherical deformation while providing a reliable electrical connection. The contact systems used accommodate both Pb and Pb–free balls.

Buckling beam contacts for BGA pitches 0.5mm and below

Above: (Left) Buckling beam, used for BGA pitches 0.5 mm and below. (Right) 0.5 mm buckling beam, TI Internal SEM photograph showing consistent alignment of witness mark.

Mechanical Characteristics
Contact system
Normally uncompressed
Package insertion force
Contact force
Typical: Approximately 12g/pin
Range: 10–14g/pin
Minimum: 10,000 cycles
Temperature range
-55°C to 150°C
Contact point
Side of solder ball
Maximum IC offset
During load: ±1.0 mm in X or Y axis
Actuation force
1.2kg to 5.0kg

Electrical Characteristics
Current rating
0.25 amp per pin
Insulation resistance
1000 Mohms at 500V DC
Dielectric voltage
Withstands 500V AC for 1 minute
Contact resistance at 10mA
Initial: 100 mohm maximum
After 10K cycles: 1 ohm maximum
6nH at 50 MHz, approximately
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BGA buckling beam contact

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Product Availability
Maximum package sizes and socket dimensions

Package max: 15 x 15 mm
Outline max: 40 x 40 mm

Package max: 10 x 10 mm
Outline max: 30 x 30 mm

Package max: 11 x 10 mm
Outline max: 26 x 19.50 mm


Buckling beam contact
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